Huawei unveiled its first in-house chipset ever last year after entering the semiconductor business. HiSilicon Kirin 920 was the Chipset’s name and it was an octa core with Cortex A15 and A7 designed chips that are split equally ( 4 by 4). The SoC was manufactured using a 28nm manufacturing process coupled with ARM’s Mali T628 GPU.
The key features of this chipset include an integrated LTE category 6 support with a dedicated audio decoding chip which is the “Tensilica HIFI3”. Added to that, there’s 4K video recording support with a max video display output of 2K or if you may QHD (2560 by 1440P).
Huawei’s HiSilicon Kirin 920 chipset was also featured in the company’s Honor 6 phone. However, we will be talking about the new and updated processor that is expected to be officially announced before the year runs out.
The new system on chip is the Kirin 950, and it’s been manufactured by TSMC and is based on the 16nm FinFET manufacturing process.
We’ve covered many tidbits that popped up over Qualcomm’s highly anticipated 820 chipset that would be based on Samsung’s 14nm process. And just as expected, many semiconductor manufacturers are moving over to smaller die processes to be able to manufacture processors with faster throughputs and most importantly enhancements that will see to longer battery life.
The necessity of basing processors off a smaller die became mainstream after the Samsung Exynos 7420 which was powering the S6 series flagships saw great success.
Not straying too far from the point; our sources have it that TSMC has been on with the manufacturing of the Kirin 950 for quite some time now and it’s basing it off its 16nm process.
Allegedly, the top-tier Kirin 950 will be available in ARM’s big.LITTLE configuration of four combined A72 core and A53 cores.
The Cortex A72 cores are the performers that will fire up when you’re running power hungry processes while the A53 cores are used for the regular operational needs of your smartphone, especially because they are more power efficient. However, it is unknown at what clock speeds the respective cores (expected to be featured) in the Kirin 950 will run at.
Sometime last week we covered TSMC’s new 16FFC (compact FinFET process) with details on the new manufacturing process. Today, news has it that the company’s 16FF yield is much improved and guaranteed for the mass production of Huawei upcoming HiSilicon Kirin 950 chip.
Other details that surfaced on Huawei’s Kirin 950 include ARM’s Mali T880 GPU fusion with the CPU and the latest LPDDR4 RAM support.
The supported display resolution is anything up to 4KUHD which is ultra-high-def. at a whopping resolution of 3840 by 2160.
There’s a chance we will see the same Mali T880 GPU coupled with Samsung’s newest mongoose CPU (which is yet to be officially released) while Qualcomm remains with its custom Kyro cores and GPU.
Advancement in the mobile CPU market is fast paced and the end of this year to Q1 of 2016 will see the unfolding of new semiconductor technologies. While we sit and wait; scroll down to the comments below and share your thoughts with us.